TechSpot: Engineers at R&D company Xerox PARC have developed a computer chip that can explode on demand as part of DARPA’s Vanishing Programmable Resources project. The chips are designed to shatter into tiny pieces, ensuring that no one is able to reconstruct them and read their contents.
It’s one thing to read about a true breakthrough, something else to see it in action
Extremetech: A new way to build computers is on the horizon, and Xerox intends to be the company that brings it to us. Their new technique, known as xerographic micro-assembly, breaks down old-fashioned silicon chip designs into thousands of tiny chiplets, and then custom assembles them with an advanced and mysterious 3D printing machine.
Engadget - ThinFilm and the legendary PARC (of mouse and GUI fame) announced they have produced a working prototype of a printable circuit that incorporated organic, rewritable memory and transistors. The resulting integrated circuits are essentially CMOS "chips" that can be printed on large rolls at extremely low cost.
